Cite This Page

Jump to navigation Jump to search

Bibliographic details for 18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)

APA style

18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.). (2024, March 22). WikiPatents, . Retrieved 09:14, June 26, 2024 from http://wikipatents.org/index.php?title=18334100._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_USING_SACRIFICIAL_LAYER_AND_SEMICONDUCTOR_PACKAGE_MANUFACTURED_BY_USING_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=41284.

MLA style

"18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 22 Mar 2024, 06:32 UTC. 26 Jun 2024, 09:14 <http://wikipatents.org/index.php?title=18334100._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_USING_SACRIFICIAL_LAYER_AND_SEMICONDUCTOR_PACKAGE_MANUFACTURED_BY_USING_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=41284>.

MHRA style

WikiPatents contributors, '18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 22 March 2024, 06:32 UTC, <http://wikipatents.org/index.php?title=18334100._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_USING_SACRIFICIAL_LAYER_AND_SEMICONDUCTOR_PACKAGE_MANUFACTURED_BY_USING_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=41284> [accessed 26 June 2024]

Chicago style

WikiPatents contributors, "18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18334100._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_USING_SACRIFICIAL_LAYER_AND_SEMICONDUCTOR_PACKAGE_MANUFACTURED_BY_USING_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=41284 (accessed June 26, 2024).

CBE/CSE style

WikiPatents contributors. 18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Mar 22, 06:32 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18334100._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_USING_SACRIFICIAL_LAYER_AND_SEMICONDUCTOR_PACKAGE_MANUFACTURED_BY_USING_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=41284.

Bluebook style

18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18334100._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_USING_SACRIFICIAL_LAYER_AND_SEMICONDUCTOR_PACKAGE_MANUFACTURED_BY_USING_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=41284 (last visited June 26, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18334100._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_USING_SACRIFICIAL_LAYER_AND_SEMICONDUCTOR_PACKAGE_MANUFACTURED_BY_USING_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=41284",
   note = "[Online; accessed 26-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18334100._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_USING_SACRIFICIAL_LAYER_AND_SEMICONDUCTOR_PACKAGE_MANUFACTURED_BY_USING_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=41284}",
   note = "[Online; accessed 26-June-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"