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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract
- Page name: Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 21 March 2024 10:10 UTC
- Date retrieved: 26 June 2024 03:57 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345
- Page Version ID: 40345
Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract
APA style
Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract. (2024, March 21). WikiPatents, . Retrieved 03:57, June 26, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345.
MLA style
"Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract." WikiPatents, . 21 Mar 2024, 10:10 UTC. 26 Jun 2024, 03:57 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345>.
MHRA style
WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract', WikiPatents, , 21 March 2024, 10:10 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract [Internet]. WikiPatents, ; 2024 Mar 21, 10:10 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345.
Bluebook style
Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345", note = "[Online; accessed 26-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345}", note = "[Online; accessed 26-June-2024]" }