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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract

Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract

APA style

Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract. (2024, March 21). WikiPatents, . Retrieved 03:42, June 23, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096740)._PACKAGE_STRUCTURE_HAVING_THERMOELECTRIC_COOLER_simplified_abstract&oldid=40325.

MLA style

"Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract." WikiPatents, . 21 Mar 2024, 10:08 UTC. 23 Jun 2024, 03:42 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096740)._PACKAGE_STRUCTURE_HAVING_THERMOELECTRIC_COOLER_simplified_abstract&oldid=40325>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract', WikiPatents, , 21 March 2024, 10:08 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096740)._PACKAGE_STRUCTURE_HAVING_THERMOELECTRIC_COOLER_simplified_abstract&oldid=40325> [accessed 23 June 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096740)._PACKAGE_STRUCTURE_HAVING_THERMOELECTRIC_COOLER_simplified_abstract&oldid=40325 (accessed June 23, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract [Internet]. WikiPatents, ; 2024 Mar 21, 10:08 UTC [cited 2024 Jun 23]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096740)._PACKAGE_STRUCTURE_HAVING_THERMOELECTRIC_COOLER_simplified_abstract&oldid=40325.

Bluebook style

Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096740)._PACKAGE_STRUCTURE_HAVING_THERMOELECTRIC_COOLER_simplified_abstract&oldid=40325 (last visited June 23, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096740)._PACKAGE_STRUCTURE_HAVING_THERMOELECTRIC_COOLER_simplified_abstract&oldid=40325",
   note = "[Online; accessed 23-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096740)._PACKAGE_STRUCTURE_HAVING_THERMOELECTRIC_COOLER_simplified_abstract&oldid=40325}",
   note = "[Online; accessed 23-June-2024]"
 }


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