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Bibliographic details for US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract
- Page name: US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 23 October 2023 15:31 UTC
- Date retrieved: 25 June 2024 07:02 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945
- Page Version ID: 3945
Citation styles for US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract
APA style
US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract. (2023, October 23). WikiPatents, . Retrieved 07:02, June 25, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945.
MLA style
"US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract." WikiPatents, . 23 Oct 2023, 15:31 UTC. 25 Jun 2024, 07:02 <http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945>.
MHRA style
WikiPatents contributors, 'US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract', WikiPatents, , 23 October 2023, 15:31 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945> [accessed 25 June 2024]
Chicago style
WikiPatents contributors, "US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945 (accessed June 25, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract [Internet]. WikiPatents, ; 2023 Oct 23, 15:31 UTC [cited 2024 Jun 25]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945.
Bluebook style
US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945 (last visited June 25, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945",
note = "[Online; accessed 25-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18339102._High_Density_3D_Interconnect_Configuration_simplified_abstract&oldid=3945}",
note = "[Online; accessed 25-June-2024]"
}
