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Citation styles for 18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, March 17). WikiPatents, . Retrieved 18:47, September 24, 2024 from http://wikipatents.org/index.php?title=18149240._DEEP_TRENCH_ISOLATION_STRUCTURE_FOR_HIGH_RESOLUTION_CIS_PIXEL_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37442.

MLA style

"18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 17 Mar 2024, 00:02 UTC. 24 Sep 2024, 18:47 <http://wikipatents.org/index.php?title=18149240._DEEP_TRENCH_ISOLATION_STRUCTURE_FOR_HIGH_RESOLUTION_CIS_PIXEL_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37442>.

MHRA style

WikiPatents contributors, '18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 17 March 2024, 00:02 UTC, <http://wikipatents.org/index.php?title=18149240._DEEP_TRENCH_ISOLATION_STRUCTURE_FOR_HIGH_RESOLUTION_CIS_PIXEL_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37442> [accessed 24 September 2024]

Chicago style

WikiPatents contributors, "18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18149240._DEEP_TRENCH_ISOLATION_STRUCTURE_FOR_HIGH_RESOLUTION_CIS_PIXEL_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37442 (accessed September 24, 2024).

CBE/CSE style

WikiPatents contributors. 18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Mar 17, 00:02 UTC [cited 2024 Sep 24]. Available from: http://wikipatents.org/index.php?title=18149240._DEEP_TRENCH_ISOLATION_STRUCTURE_FOR_HIGH_RESOLUTION_CIS_PIXEL_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37442.

Bluebook style

18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18149240._DEEP_TRENCH_ISOLATION_STRUCTURE_FOR_HIGH_RESOLUTION_CIS_PIXEL_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37442 (last visited September 24, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18149240._DEEP_TRENCH_ISOLATION_STRUCTURE_FOR_HIGH_RESOLUTION_CIS_PIXEL_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37442",
   note = "[Online; accessed 24-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18149240. DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18149240._DEEP_TRENCH_ISOLATION_STRUCTURE_FOR_HIGH_RESOLUTION_CIS_PIXEL_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37442}",
   note = "[Online; accessed 24-September-2024]"
 }