Cite This Page

Jump to navigation Jump to search

Bibliographic details for 18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

Citation styles for 18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, March 16). WikiPatents, . Retrieved 10:07, June 27, 2024 from http://wikipatents.org/index.php?title=18518794._FABRICATING_METHOD_OF_SEMICONDUCTOR_DIE_WITH_TAPERED_SIDEWALL_IN_PACKAGE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37418.

MLA style

"18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 16 Mar 2024, 23:58 UTC. 27 Jun 2024, 10:07 <http://wikipatents.org/index.php?title=18518794._FABRICATING_METHOD_OF_SEMICONDUCTOR_DIE_WITH_TAPERED_SIDEWALL_IN_PACKAGE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37418>.

MHRA style

WikiPatents contributors, '18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 16 March 2024, 23:58 UTC, <http://wikipatents.org/index.php?title=18518794._FABRICATING_METHOD_OF_SEMICONDUCTOR_DIE_WITH_TAPERED_SIDEWALL_IN_PACKAGE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37418> [accessed 27 June 2024]

Chicago style

WikiPatents contributors, "18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18518794._FABRICATING_METHOD_OF_SEMICONDUCTOR_DIE_WITH_TAPERED_SIDEWALL_IN_PACKAGE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37418 (accessed June 27, 2024).

CBE/CSE style

WikiPatents contributors. 18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Mar 16, 23:58 UTC [cited 2024 Jun 27]. Available from: http://wikipatents.org/index.php?title=18518794._FABRICATING_METHOD_OF_SEMICONDUCTOR_DIE_WITH_TAPERED_SIDEWALL_IN_PACKAGE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37418.

Bluebook style

18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18518794._FABRICATING_METHOD_OF_SEMICONDUCTOR_DIE_WITH_TAPERED_SIDEWALL_IN_PACKAGE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37418 (last visited June 27, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18518794._FABRICATING_METHOD_OF_SEMICONDUCTOR_DIE_WITH_TAPERED_SIDEWALL_IN_PACKAGE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37418",
   note = "[Online; accessed 27-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18518794._FABRICATING_METHOD_OF_SEMICONDUCTOR_DIE_WITH_TAPERED_SIDEWALL_IN_PACKAGE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37418}",
   note = "[Online; accessed 27-June-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"