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Bibliographic details for 18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

Citation styles for 18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, March 16). WikiPatents, . Retrieved 22:53, June 25, 2024 from http://wikipatents.org/index.php?title=18511102._ENLARGING_CONTACT_AREA_AND_PROCESS_WINDOW_FOR_A_CONTACT_VIA_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37383.

MLA style

"18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 16 Mar 2024, 23:56 UTC. 25 Jun 2024, 22:53 <http://wikipatents.org/index.php?title=18511102._ENLARGING_CONTACT_AREA_AND_PROCESS_WINDOW_FOR_A_CONTACT_VIA_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37383>.

MHRA style

WikiPatents contributors, '18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 16 March 2024, 23:56 UTC, <http://wikipatents.org/index.php?title=18511102._ENLARGING_CONTACT_AREA_AND_PROCESS_WINDOW_FOR_A_CONTACT_VIA_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37383> [accessed 25 June 2024]

Chicago style

WikiPatents contributors, "18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18511102._ENLARGING_CONTACT_AREA_AND_PROCESS_WINDOW_FOR_A_CONTACT_VIA_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37383 (accessed June 25, 2024).

CBE/CSE style

WikiPatents contributors. 18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Mar 16, 23:56 UTC [cited 2024 Jun 25]. Available from: http://wikipatents.org/index.php?title=18511102._ENLARGING_CONTACT_AREA_AND_PROCESS_WINDOW_FOR_A_CONTACT_VIA_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37383.

Bluebook style

18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18511102._ENLARGING_CONTACT_AREA_AND_PROCESS_WINDOW_FOR_A_CONTACT_VIA_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37383 (last visited June 25, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18511102._ENLARGING_CONTACT_AREA_AND_PROCESS_WINDOW_FOR_A_CONTACT_VIA_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37383",
   note = "[Online; accessed 25-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18511102._ENLARGING_CONTACT_AREA_AND_PROCESS_WINDOW_FOR_A_CONTACT_VIA_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37383}",
   note = "[Online; accessed 25-June-2024]"
 }


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