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Citation styles for 18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)

APA style

18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.). (2024, March 4). WikiPatents, . Retrieved 03:17, June 17, 2024 from http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435.

MLA style

"18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)." WikiPatents, . 4 Mar 2024, 05:07 UTC. 17 Jun 2024, 03:17 <http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435>.

MHRA style

WikiPatents contributors, '18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)', WikiPatents, , 4 March 2024, 05:07 UTC, <http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435> [accessed 17 June 2024]

Chicago style

WikiPatents contributors, "18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435 (accessed June 17, 2024).

CBE/CSE style

WikiPatents contributors. 18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Mar 4, 05:07 UTC [cited 2024 Jun 17]. Available from: http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435.

Bluebook style

18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435 (last visited June 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435",
   note = "[Online; accessed 17-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435}",
   note = "[Online; accessed 17-June-2024]"
 }