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Bibliographic details for 18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)
- Page name: 18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 March 2024 05:07 UTC
- Date retrieved: 27 September 2024 15:42 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435
- Page Version ID: 36435
Citation styles for 18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)
APA style
18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.). (2024, March 4). WikiPatents, . Retrieved 15:42, September 27, 2024 from http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435.
MLA style
"18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)." WikiPatents, . 4 Mar 2024, 05:07 UTC. 27 Sep 2024, 15:42 <http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435>.
MHRA style
WikiPatents contributors, '18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)', WikiPatents, , 4 March 2024, 05:07 UTC, <http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435> [accessed 27 September 2024]
Chicago style
WikiPatents contributors, "18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435 (accessed September 27, 2024).
CBE/CSE style
WikiPatents contributors. 18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Mar 4, 05:07 UTC [cited 2024 Sep 27]. Available from: http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435.
Bluebook style
18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435 (last visited September 27, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435", note = "[Online; accessed 27-September-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18237259._SEMICONDUCTOR_DEVICE_WITH_CIRCUIT_COMPONENTS_FORMED_THROUGH_INTER-DIE_CONNECTIONS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36435}", note = "[Online; accessed 27-September-2024]" }