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Bibliographic details for 17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- Page name: 17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 March 2024 05:06 UTC
- Date retrieved: 23 June 2024 18:31 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430
- Page Version ID: 36430
Citation styles for 17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
APA style
17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.). (2024, March 4). WikiPatents, . Retrieved 18:31, June 23, 2024 from http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430.
MLA style
"17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)." WikiPatents, . 4 Mar 2024, 05:06 UTC. 23 Jun 2024, 18:31 <http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430>.
MHRA style
WikiPatents contributors, '17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)', WikiPatents, , 4 March 2024, 05:06 UTC, <http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430> [accessed 23 June 2024]
Chicago style
WikiPatents contributors, "17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430 (accessed June 23, 2024).
CBE/CSE style
WikiPatents contributors. 17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Mar 4, 05:06 UTC [cited 2024 Jun 23]. Available from: http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430.
Bluebook style
17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430 (last visited June 23, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430", note = "[Online; accessed 23-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17898330._PIEZOELECTRIC_MATERIALS_FOR_ON-DIE_THERMAL_ENHANCEMENT_OF_HYBRID_BONDING_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36430}", note = "[Online; accessed 23-June-2024]" }