Cite This Page
Bibliographic details for 17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.)
- Page name: 17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 March 2024 05:04 UTC
- Date retrieved: 26 June 2024 09:04 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405
- Page Version ID: 36405
Citation styles for 17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.)
APA style
17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.). (2024, March 4). WikiPatents, . Retrieved 09:04, June 26, 2024 from http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405.
MLA style
"17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.)." WikiPatents, . 4 Mar 2024, 05:04 UTC. 26 Jun 2024, 09:04 <http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405>.
MHRA style
WikiPatents contributors, '17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.)', WikiPatents, , 4 March 2024, 05:04 UTC, <http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. 17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Mar 4, 05:04 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405.
Bluebook style
17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405",
note = "[Online; accessed 26-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17894102. SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17894102._SPLIT_VIA_STRUCTURE_FOR_SEMICONDUCTOR_DEVICE_PACKAGING_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36405}",
note = "[Online; accessed 26-June-2024]"
}
