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Bibliographic details for 18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.)
- Page name: 18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 March 2024 03:31 UTC
- Date retrieved: 26 June 2024 10:41 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075
- Page Version ID: 36075
Citation styles for 18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.)
APA style
18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.). (2024, March 4). WikiPatents, . Retrieved 10:41, June 26, 2024 from http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075.
MLA style
"18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 4 Mar 2024, 03:31 UTC. 26 Jun 2024, 10:41 <http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075>.
MHRA style
WikiPatents contributors, '18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 4 March 2024, 03:31 UTC, <http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. 18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Mar 4, 03:31 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075.
Bluebook style
18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075",
note = "[Online; accessed 26-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18335336._PACKAGED_INTEGRATED_CIRCUIT_HAVING_ENHANCED_ELECTRICAL_INTERCONNECTS_THEREIN_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36075}",
note = "[Online; accessed 26-June-2024]"
}
