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Bibliographic details for 18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

APA style

18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.). (2024, March 4). WikiPatents, . Retrieved 11:36, June 26, 2024 from http://wikipatents.org/index.php?title=18302401._LAYOUT_METHOD_OF_SEMICONDUCTOR,_INSPECTION_METHOD_OF_WAFER,_MANUFACTURING_METHOD_OF_THE_WAFER_AND_MANUFACTURING_METHOD_OF_MULTI-CHIP_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36070.

MLA style

"18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 4 Mar 2024, 03:30 UTC. 26 Jun 2024, 11:36 <http://wikipatents.org/index.php?title=18302401._LAYOUT_METHOD_OF_SEMICONDUCTOR,_INSPECTION_METHOD_OF_WAFER,_MANUFACTURING_METHOD_OF_THE_WAFER_AND_MANUFACTURING_METHOD_OF_MULTI-CHIP_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36070>.

MHRA style

WikiPatents contributors, '18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 4 March 2024, 03:30 UTC, <http://wikipatents.org/index.php?title=18302401._LAYOUT_METHOD_OF_SEMICONDUCTOR,_INSPECTION_METHOD_OF_WAFER,_MANUFACTURING_METHOD_OF_THE_WAFER_AND_MANUFACTURING_METHOD_OF_MULTI-CHIP_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36070> [accessed 26 June 2024]

Chicago style

WikiPatents contributors, "18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18302401._LAYOUT_METHOD_OF_SEMICONDUCTOR,_INSPECTION_METHOD_OF_WAFER,_MANUFACTURING_METHOD_OF_THE_WAFER_AND_MANUFACTURING_METHOD_OF_MULTI-CHIP_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36070 (accessed June 26, 2024).

CBE/CSE style

WikiPatents contributors. 18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Mar 4, 03:30 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18302401._LAYOUT_METHOD_OF_SEMICONDUCTOR,_INSPECTION_METHOD_OF_WAFER,_MANUFACTURING_METHOD_OF_THE_WAFER_AND_MANUFACTURING_METHOD_OF_MULTI-CHIP_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36070.

Bluebook style

18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18302401._LAYOUT_METHOD_OF_SEMICONDUCTOR,_INSPECTION_METHOD_OF_WAFER,_MANUFACTURING_METHOD_OF_THE_WAFER_AND_MANUFACTURING_METHOD_OF_MULTI-CHIP_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36070 (last visited June 26, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18302401._LAYOUT_METHOD_OF_SEMICONDUCTOR,_INSPECTION_METHOD_OF_WAFER,_MANUFACTURING_METHOD_OF_THE_WAFER_AND_MANUFACTURING_METHOD_OF_MULTI-CHIP_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36070",
   note = "[Online; accessed 26-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18302401._LAYOUT_METHOD_OF_SEMICONDUCTOR,_INSPECTION_METHOD_OF_WAFER,_MANUFACTURING_METHOD_OF_THE_WAFER_AND_MANUFACTURING_METHOD_OF_MULTI-CHIP_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36070}",
   note = "[Online; accessed 26-June-2024]"
 }


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