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Bibliographic details for THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)
- Page name: THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 October 2023 16:12 UTC
- Date retrieved: 20 June 2024 00:10 UTC
- Permanent URL: http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355
- Page Version ID: 355
Citation styles for THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)
APA style
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394). (2023, October 1). WikiPatents, . Retrieved 00:10, June 20, 2024 from http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355.
MLA style
"THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)." WikiPatents, . 1 Oct 2023, 16:12 UTC. 20 Jun 2024, 00:10 <http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355>.
MHRA style
WikiPatents contributors, 'THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)', WikiPatents, , 1 October 2023, 16:12 UTC, <http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355> [accessed 20 June 2024]
Chicago style
WikiPatents contributors, "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)," WikiPatents, , http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355 (accessed June 20, 2024).
CBE/CSE style
WikiPatents contributors. THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) [Internet]. WikiPatents, ; 2023 Oct 1, 16:12 UTC [cited 2024 Jun 20]. Available from: http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355.
Bluebook style
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394), http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355 (last visited June 20, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) --- WikiPatents{,} ", year = "2023", url = "http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355", note = "[Online; accessed 20-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) --- WikiPatents{,} ", year = "2023", url = "\url{http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=355}", note = "[Online; accessed 20-June-2024]" }