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Bibliographic details for 18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)
- Page name: 18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 20 February 2024 07:13 UTC
- Date retrieved: 26 June 2024 08:24 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475
- Page Version ID: 35475
Citation styles for 18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)
APA style
18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy). (2024, February 20). WikiPatents, . Retrieved 08:24, June 26, 2024 from http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475.
MLA style
"18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)." WikiPatents, . 20 Feb 2024, 07:13 UTC. 26 Jun 2024, 08:24 <http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475>.
MHRA style
WikiPatents contributors, '18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)', WikiPatents, , 20 February 2024, 07:13 UTC, <http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)," WikiPatents, , http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. 18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy) [Internet]. WikiPatents, ; 2024 Feb 20, 07:13 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475.
Bluebook style
18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy), http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475",
note = "[Online; accessed 26-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18229700._Three-Dimensional_Chip_Comprising_Heat_Transfer_Means_simplified_abstract_(Nokia_Technologies_Oy)&oldid=35475}",
note = "[Online; accessed 26-June-2024]"
}
