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Citation styles for 18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, February 20). WikiPatents, . Retrieved 01:53, June 29, 2024 from http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537.

MLA style

"18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 20 Feb 2024, 04:47 UTC. 29 Jun 2024, 01:53 <http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537>.

MHRA style

WikiPatents contributors, '18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 20 February 2024, 04:47 UTC, <http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537> [accessed 29 June 2024]

Chicago style

WikiPatents contributors, "18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537 (accessed June 29, 2024).

CBE/CSE style

WikiPatents contributors. 18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Feb 20, 04:47 UTC [cited 2024 Jun 29]. Available from: http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537.

Bluebook style

18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537 (last visited June 29, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537",
   note = "[Online; accessed 29-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537}",
   note = "[Online; accessed 29-June-2024]"
 }