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Bibliographic details for 18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Page name: 18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 20 February 2024 04:47 UTC
- Date retrieved: 1 July 2024 05:18 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537
- Page Version ID: 34537
Citation styles for 18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APA style
18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, February 20). WikiPatents, . Retrieved 05:18, July 1, 2024 from http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537.
MLA style
"18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 20 Feb 2024, 04:47 UTC. 1 Jul 2024, 05:18 <http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537>.
MHRA style
WikiPatents contributors, '18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 20 February 2024, 04:47 UTC, <http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537> [accessed 1 July 2024]
Chicago style
WikiPatents contributors, "18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537 (accessed July 1, 2024).
CBE/CSE style
WikiPatents contributors. 18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Feb 20, 04:47 UTC [cited 2024 Jul 1]. Available from: http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537.
Bluebook style
18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537 (last visited July 1, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537", note = "[Online; accessed 1-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18206201._SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_BONDED_TO_MEMORY_DIES_USING_WIRES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34537}", note = "[Online; accessed 1-July-2024]" }