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Bibliographic details for 18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, February 20). WikiPatents, . Retrieved 16:11, June 17, 2024 from http://wikipatents.org/index.php?title=18315689._HIGHLY_INTEGRATED_SEMICONDUCTOR_DEVICE_CONTAINING_MULTIPLE_BONDED_DIES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34531.

MLA style

"18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 20 Feb 2024, 04:46 UTC. 17 Jun 2024, 16:11 <http://wikipatents.org/index.php?title=18315689._HIGHLY_INTEGRATED_SEMICONDUCTOR_DEVICE_CONTAINING_MULTIPLE_BONDED_DIES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34531>.

MHRA style

WikiPatents contributors, '18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 20 February 2024, 04:46 UTC, <http://wikipatents.org/index.php?title=18315689._HIGHLY_INTEGRATED_SEMICONDUCTOR_DEVICE_CONTAINING_MULTIPLE_BONDED_DIES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34531> [accessed 17 June 2024]

Chicago style

WikiPatents contributors, "18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18315689._HIGHLY_INTEGRATED_SEMICONDUCTOR_DEVICE_CONTAINING_MULTIPLE_BONDED_DIES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34531 (accessed June 17, 2024).

CBE/CSE style

WikiPatents contributors. 18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Feb 20, 04:46 UTC [cited 2024 Jun 17]. Available from: http://wikipatents.org/index.php?title=18315689._HIGHLY_INTEGRATED_SEMICONDUCTOR_DEVICE_CONTAINING_MULTIPLE_BONDED_DIES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34531.

Bluebook style

18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18315689._HIGHLY_INTEGRATED_SEMICONDUCTOR_DEVICE_CONTAINING_MULTIPLE_BONDED_DIES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34531 (last visited June 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18315689._HIGHLY_INTEGRATED_SEMICONDUCTOR_DEVICE_CONTAINING_MULTIPLE_BONDED_DIES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34531",
   note = "[Online; accessed 17-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18315689._HIGHLY_INTEGRATED_SEMICONDUCTOR_DEVICE_CONTAINING_MULTIPLE_BONDED_DIES_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=34531}",
   note = "[Online; accessed 17-June-2024]"
 }


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