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Bibliographic details for 20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- Page name: 20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 9 February 2024 03:45 UTC
- Date retrieved: 23 June 2024 19:23 UTC
- Permanent URL: http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823
- Page Version ID: 32823
Citation styles for 20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
APA style
20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC). (2024, February 9). WikiPatents, . Retrieved 19:23, June 23, 2024 from http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823.
MLA style
"20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)." WikiPatents, . 9 Feb 2024, 03:45 UTC. 23 Jun 2024, 19:23 <http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823>.
MHRA style
WikiPatents contributors, '20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)', WikiPatents, , 9 February 2024, 03:45 UTC, <http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823> [accessed 23 June 2024]
Chicago style
WikiPatents contributors, "20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)," WikiPatents, , http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823 (accessed June 23, 2024).
CBE/CSE style
WikiPatents contributors. 20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC) [Internet]. WikiPatents, ; 2024 Feb 9, 03:45 UTC [cited 2024 Jun 23]. Available from: http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823.
Bluebook style
20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC), http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823 (last visited June 23, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823",
note = "[Online; accessed 23-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=20240047304._JET_IMPINGEMENT_COOLING_WITH_BYPASS_FLUID_PORTION_FOR_HIGH_POWER_SEMICONDUCTOR_DEVICES_simplified_abstract_(SEMICONDUCTOR_COMPONENTS_INDUSTRIES,_LLC)&oldid=32823}",
note = "[Online; accessed 23-June-2024]"
}
