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Bibliographic details for 18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Page name: 18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 February 2024 05:31 UTC
- Date retrieved: 28 June 2024 21:34 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664
- Page Version ID: 31664
Citation styles for 18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
APA style
18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, February 2). WikiPatents, . Retrieved 21:34, June 28, 2024 from http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664.
MLA style
"18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 2 Feb 2024, 05:31 UTC. 28 Jun 2024, 21:34 <http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664>.
MHRA style
WikiPatents contributors, '18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 2 February 2024, 05:31 UTC, <http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664> [accessed 28 June 2024]
Chicago style
WikiPatents contributors, "18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664 (accessed June 28, 2024).
CBE/CSE style
WikiPatents contributors. 18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Feb 2, 05:31 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664.
Bluebook style
18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664 (last visited June 28, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664", note = "[Online; accessed 28-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664}", note = "[Online; accessed 28-June-2024]" }