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Bibliographic details for 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, February 2). WikiPatents, . Retrieved 03:26, June 29, 2024 from http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205.

MLA style

"18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 2 Feb 2024, 04:37 UTC. 29 Jun 2024, 03:26 <http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205>.

MHRA style

WikiPatents contributors, '18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 2 February 2024, 04:37 UTC, <http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205> [accessed 29 June 2024]

Chicago style

WikiPatents contributors, "18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205 (accessed June 29, 2024).

CBE/CSE style

WikiPatents contributors. 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Feb 2, 04:37 UTC [cited 2024 Jun 29]. Available from: http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205.

Bluebook style

18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205 (last visited June 29, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205",
   note = "[Online; accessed 29-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205}",
   note = "[Online; accessed 29-June-2024]"
 }


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