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Bibliographic details for 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Page name: 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 February 2024 04:37 UTC
- Date retrieved: 1 July 2024 06:40 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205
- Page Version ID: 31205
Citation styles for 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APA style
18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, February 2). WikiPatents, . Retrieved 06:40, July 1, 2024 from http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205.
MLA style
"18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 2 Feb 2024, 04:37 UTC. 1 Jul 2024, 06:40 <http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205>.
MHRA style
WikiPatents contributors, '18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 2 February 2024, 04:37 UTC, <http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205> [accessed 1 July 2024]
Chicago style
WikiPatents contributors, "18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205 (accessed July 1, 2024).
CBE/CSE style
WikiPatents contributors. 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Feb 2, 04:37 UTC [cited 2024 Jul 1]. Available from: http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205.
Bluebook style
18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205 (last visited July 1, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205", note = "[Online; accessed 1-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18486574._WIRING_MATERIAL_FOR_SEMICONDUCTOR_DEVICE,_WIRING_FOR_SEMICONDUCTOR_DEVICE_INCLUDING_THE_SAME,_AND_SEMICONDUCTOR_DEVICE_INCLUDING_THE_WIRING_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31205}", note = "[Online; accessed 1-July-2024]" }