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Bibliographic details for 18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, February 2). WikiPatents, . Retrieved 12:53, June 26, 2024 from http://wikipatents.org/index.php?title=18319850._PLASMA_PROCESSING_APPARATUS,_WAFER_TO_WAFER_BONDING_SYSTEM_AND_WAFER_TO_WAFER_BONDING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31196.

MLA style

"18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 2 Feb 2024, 04:36 UTC. 26 Jun 2024, 12:53 <http://wikipatents.org/index.php?title=18319850._PLASMA_PROCESSING_APPARATUS,_WAFER_TO_WAFER_BONDING_SYSTEM_AND_WAFER_TO_WAFER_BONDING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31196>.

MHRA style

WikiPatents contributors, '18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 2 February 2024, 04:36 UTC, <http://wikipatents.org/index.php?title=18319850._PLASMA_PROCESSING_APPARATUS,_WAFER_TO_WAFER_BONDING_SYSTEM_AND_WAFER_TO_WAFER_BONDING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31196> [accessed 26 June 2024]

Chicago style

WikiPatents contributors, "18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18319850._PLASMA_PROCESSING_APPARATUS,_WAFER_TO_WAFER_BONDING_SYSTEM_AND_WAFER_TO_WAFER_BONDING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31196 (accessed June 26, 2024).

CBE/CSE style

WikiPatents contributors. 18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Feb 2, 04:36 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18319850._PLASMA_PROCESSING_APPARATUS,_WAFER_TO_WAFER_BONDING_SYSTEM_AND_WAFER_TO_WAFER_BONDING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31196.

Bluebook style

18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18319850._PLASMA_PROCESSING_APPARATUS,_WAFER_TO_WAFER_BONDING_SYSTEM_AND_WAFER_TO_WAFER_BONDING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31196 (last visited June 26, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18319850._PLASMA_PROCESSING_APPARATUS,_WAFER_TO_WAFER_BONDING_SYSTEM_AND_WAFER_TO_WAFER_BONDING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31196",
   note = "[Online; accessed 26-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18319850._PLASMA_PROCESSING_APPARATUS,_WAFER_TO_WAFER_BONDING_SYSTEM_AND_WAFER_TO_WAFER_BONDING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=31196}",
   note = "[Online; accessed 26-June-2024]"
 }


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