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Bibliographic details for 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
- Page name: 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 30 January 2024 09:38 UTC
- Date retrieved: 16 June 2024 05:21 UTC
- Permanent URL: http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898
- Page Version ID: 29898
Citation styles for 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
APA style
20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.). (2024, January 30). WikiPatents, . Retrieved 05:21, June 16, 2024 from http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898.
MLA style
"20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)." WikiPatents, . 30 Jan 2024, 09:38 UTC. 16 Jun 2024, 05:21 <http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898>.
MHRA style
WikiPatents contributors, '20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)', WikiPatents, , 30 January 2024, 09:38 UTC, <http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898> [accessed 16 June 2024]
Chicago style
WikiPatents contributors, "20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898 (accessed June 16, 2024).
CBE/CSE style
WikiPatents contributors. 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.) [Internet]. WikiPatents, ; 2024 Jan 30, 09:38 UTC [cited 2024 Jun 16]. Available from: http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898.
Bluebook style
20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.), http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898 (last visited June 16, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898",
note = "[Online; accessed 16-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=20240030088._HEAT_SPREADER_ASSEMBLY_FOR_USE_WITH_A_SEMICONDUCTOR_DEVICE_simplified_abstract_(STATS_ChipPAC_Pte._Ltd.)&oldid=29898}",
note = "[Online; accessed 16-June-2024]"
}
