Cite This Page
Bibliographic details for US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract
- Page name: US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 18 October 2023 10:41 UTC
- Date retrieved: 21 June 2024 20:13 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949
- Page Version ID: 2949
Citation styles for US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract
APA style
US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract. (2023, October 18). WikiPatents, . Retrieved 20:13, June 21, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949.
MLA style
"US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract." WikiPatents, . 18 Oct 2023, 10:41 UTC. 21 Jun 2024, 20:13 <http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949>.
MHRA style
WikiPatents contributors, 'US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract', WikiPatents, , 18 October 2023, 10:41 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949> [accessed 21 June 2024]
Chicago style
WikiPatents contributors, "US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949 (accessed June 21, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract [Internet]. WikiPatents, ; 2023 Oct 18, 10:41 UTC [cited 2024 Jun 21]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949.
Bluebook style
US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949 (last visited June 21, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949",
note = "[Online; accessed 21-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 17714147. SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_17714147._SEMICONDUCTOR_PACKAGE_INCLUDING_SOIC_DIE_STACKS_simplified_abstract&oldid=2949}",
note = "[Online; accessed 21-June-2024]"
}
