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Bibliographic details for 18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Page name: 18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 5 January 2024 11:09 UTC
- Date retrieved: 17 June 2024 12:38 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049
- Page Version ID: 27049
Citation styles for 18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APA style
18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, January 5). WikiPatents, . Retrieved 12:38, June 17, 2024 from http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049.
MLA style
"18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 5 Jan 2024, 11:09 UTC. 17 Jun 2024, 12:38 <http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049>.
MHRA style
WikiPatents contributors, '18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 5 January 2024, 11:09 UTC, <http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049> [accessed 17 June 2024]
Chicago style
WikiPatents contributors, "18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049 (accessed June 17, 2024).
CBE/CSE style
WikiPatents contributors. 18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jan 5, 11:09 UTC [cited 2024 Jun 17]. Available from: http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049.
Bluebook style
18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049 (last visited June 17, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049",
note = "[Online; accessed 17-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18446900._SEMICONDUCTOR_CHIP_MOLDING_DIE_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=27049}",
note = "[Online; accessed 17-June-2024]"
}
