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Bibliographic details for 17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

APA style

17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 4). WikiPatents, . Retrieved 11:27, June 24, 2024 from http://wikipatents.org/index.php?title=17881367._WAFER_INSPECTION_APPARATUS_USING_THREE-DIMENSIONAL_IMAGE_AND_METHOD_OF_INSPECTING_WAFER_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=25998.

MLA style

"17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 4 Jan 2024, 09:01 UTC. 24 Jun 2024, 11:27 <http://wikipatents.org/index.php?title=17881367._WAFER_INSPECTION_APPARATUS_USING_THREE-DIMENSIONAL_IMAGE_AND_METHOD_OF_INSPECTING_WAFER_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=25998>.

MHRA style

WikiPatents contributors, '17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 4 January 2024, 09:01 UTC, <http://wikipatents.org/index.php?title=17881367._WAFER_INSPECTION_APPARATUS_USING_THREE-DIMENSIONAL_IMAGE_AND_METHOD_OF_INSPECTING_WAFER_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=25998> [accessed 24 June 2024]

Chicago style

WikiPatents contributors, "17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17881367._WAFER_INSPECTION_APPARATUS_USING_THREE-DIMENSIONAL_IMAGE_AND_METHOD_OF_INSPECTING_WAFER_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=25998 (accessed June 24, 2024).

CBE/CSE style

WikiPatents contributors. 17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 4, 09:01 UTC [cited 2024 Jun 24]. Available from: http://wikipatents.org/index.php?title=17881367._WAFER_INSPECTION_APPARATUS_USING_THREE-DIMENSIONAL_IMAGE_AND_METHOD_OF_INSPECTING_WAFER_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=25998.

Bluebook style

17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17881367._WAFER_INSPECTION_APPARATUS_USING_THREE-DIMENSIONAL_IMAGE_AND_METHOD_OF_INSPECTING_WAFER_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=25998 (last visited June 24, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17881367._WAFER_INSPECTION_APPARATUS_USING_THREE-DIMENSIONAL_IMAGE_AND_METHOD_OF_INSPECTING_WAFER_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=25998",
   note = "[Online; accessed 24-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17881367._WAFER_INSPECTION_APPARATUS_USING_THREE-DIMENSIONAL_IMAGE_AND_METHOD_OF_INSPECTING_WAFER_USING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=25998}",
   note = "[Online; accessed 24-June-2024]"
 }


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