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Bibliographic details for 18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)

Citation styles for 18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)

APA style

18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION). (2024, October 18). WikiPatents, . Retrieved 19:20, October 19, 2024 from http://wikipatents.org/index.php?title=18294638._SEMICONDUCTOR_DEVICE_PACKAGE_AND_HEAT-DISSIPATING_LEAD_FRAME_simplified_abstract_(SONY_SEMICONDUCTOR_SOLUTIONS_CORPORATION)&oldid=255478.

MLA style

"18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)." WikiPatents, . 18 Oct 2024, 05:48 UTC. 19 Oct 2024, 19:20 <http://wikipatents.org/index.php?title=18294638._SEMICONDUCTOR_DEVICE_PACKAGE_AND_HEAT-DISSIPATING_LEAD_FRAME_simplified_abstract_(SONY_SEMICONDUCTOR_SOLUTIONS_CORPORATION)&oldid=255478>.

MHRA style

WikiPatents contributors, '18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)', WikiPatents, , 18 October 2024, 05:48 UTC, <http://wikipatents.org/index.php?title=18294638._SEMICONDUCTOR_DEVICE_PACKAGE_AND_HEAT-DISSIPATING_LEAD_FRAME_simplified_abstract_(SONY_SEMICONDUCTOR_SOLUTIONS_CORPORATION)&oldid=255478> [accessed 19 October 2024]

Chicago style

WikiPatents contributors, "18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)," WikiPatents, , http://wikipatents.org/index.php?title=18294638._SEMICONDUCTOR_DEVICE_PACKAGE_AND_HEAT-DISSIPATING_LEAD_FRAME_simplified_abstract_(SONY_SEMICONDUCTOR_SOLUTIONS_CORPORATION)&oldid=255478 (accessed October 19, 2024).

CBE/CSE style

WikiPatents contributors. 18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION) [Internet]. WikiPatents, ; 2024 Oct 18, 05:48 UTC [cited 2024 Oct 19]. Available from: http://wikipatents.org/index.php?title=18294638._SEMICONDUCTOR_DEVICE_PACKAGE_AND_HEAT-DISSIPATING_LEAD_FRAME_simplified_abstract_(SONY_SEMICONDUCTOR_SOLUTIONS_CORPORATION)&oldid=255478.

Bluebook style

18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION), http://wikipatents.org/index.php?title=18294638._SEMICONDUCTOR_DEVICE_PACKAGE_AND_HEAT-DISSIPATING_LEAD_FRAME_simplified_abstract_(SONY_SEMICONDUCTOR_SOLUTIONS_CORPORATION)&oldid=255478 (last visited October 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18294638._SEMICONDUCTOR_DEVICE_PACKAGE_AND_HEAT-DISSIPATING_LEAD_FRAME_simplified_abstract_(SONY_SEMICONDUCTOR_SOLUTIONS_CORPORATION)&oldid=255478",
   note = "[Online; accessed 19-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18294638._SEMICONDUCTOR_DEVICE_PACKAGE_AND_HEAT-DISSIPATING_LEAD_FRAME_simplified_abstract_(SONY_SEMICONDUCTOR_SOLUTIONS_CORPORATION)&oldid=255478}",
   note = "[Online; accessed 19-October-2024]"
 }


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