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Bibliographic details for 18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

Citation styles for 18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, October 18). WikiPatents, . Retrieved 03:08, October 22, 2024 from http://wikipatents.org/index.php?title=18754753._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=253406.

MLA style

"18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 18 Oct 2024, 04:18 UTC. 22 Oct 2024, 03:08 <http://wikipatents.org/index.php?title=18754753._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=253406>.

MHRA style

WikiPatents contributors, '18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 18 October 2024, 04:18 UTC, <http://wikipatents.org/index.php?title=18754753._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=253406> [accessed 22 October 2024]

Chicago style

WikiPatents contributors, "18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18754753._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=253406 (accessed October 22, 2024).

CBE/CSE style

WikiPatents contributors. 18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Oct 18, 04:18 UTC [cited 2024 Oct 22]. Available from: http://wikipatents.org/index.php?title=18754753._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=253406.

Bluebook style

18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=18754753._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=253406 (last visited October 22, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18754753._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=253406",
   note = "[Online; accessed 22-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18754753._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=253406}",
   note = "[Online; accessed 22-October-2024]"
 }


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