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Bibliographic details for 18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, October 18). WikiPatents, . Retrieved 02:35, October 22, 2024 from http://wikipatents.org/index.php?title=18403864._CHIP_ON_FILM_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_CHIP_ON_FILM_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=250082.

MLA style

"18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 18 Oct 2024, 01:41 UTC. 22 Oct 2024, 02:35 <http://wikipatents.org/index.php?title=18403864._CHIP_ON_FILM_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_CHIP_ON_FILM_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=250082>.

MHRA style

WikiPatents contributors, '18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 18 October 2024, 01:41 UTC, <http://wikipatents.org/index.php?title=18403864._CHIP_ON_FILM_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_CHIP_ON_FILM_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=250082> [accessed 22 October 2024]

Chicago style

WikiPatents contributors, "18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18403864._CHIP_ON_FILM_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_CHIP_ON_FILM_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=250082 (accessed October 22, 2024).

CBE/CSE style

WikiPatents contributors. 18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Oct 18, 01:41 UTC [cited 2024 Oct 22]. Available from: http://wikipatents.org/index.php?title=18403864._CHIP_ON_FILM_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_CHIP_ON_FILM_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=250082.

Bluebook style

18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18403864._CHIP_ON_FILM_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_CHIP_ON_FILM_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=250082 (last visited October 22, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18403864._CHIP_ON_FILM_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_CHIP_ON_FILM_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=250082",
   note = "[Online; accessed 22-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18403864._CHIP_ON_FILM_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_CHIP_ON_FILM_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=250082}",
   note = "[Online; accessed 22-October-2024]"
 }


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