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Bibliographic details for Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract

Citation styles for Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract

APA style

Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract. (2024, October 18). WikiPatents, . Retrieved 03:12, October 22, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240347412)._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract&oldid=250009.

MLA style

"Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract." WikiPatents, . 18 Oct 2024, 01:38 UTC. 22 Oct 2024, 03:12 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240347412)._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract&oldid=250009>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract', WikiPatents, , 18 October 2024, 01:38 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240347412)._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract&oldid=250009> [accessed 22 October 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240347412)._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract&oldid=250009 (accessed October 22, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract [Internet]. WikiPatents, ; 2024 Oct 18, 01:38 UTC [cited 2024 Oct 22]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240347412)._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract&oldid=250009.

Bluebook style

Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240347412)._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract&oldid=250009 (last visited October 22, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240347412)._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract&oldid=250009",
   note = "[Online; accessed 22-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240347412)._HEAT_DISPERSION_LAYERS_FOR_DOUBLE_SIDED_INTERCONNECT_simplified_abstract&oldid=250009}",
   note = "[Online; accessed 22-October-2024]"
 }


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