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Bibliographic details for Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract

Citation styles for Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract

APA style

Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract. (2024, October 18). WikiPatents, . Retrieved 05:49, October 22, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240347435)._SEMICONDUCTOR_PACKAGE_INCLUDING_UNDER_BUMP_METALLIZATION_PAD_simplified_abstract&oldid=248759.

MLA style

"Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract." WikiPatents, . 18 Oct 2024, 00:42 UTC. 22 Oct 2024, 05:49 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240347435)._SEMICONDUCTOR_PACKAGE_INCLUDING_UNDER_BUMP_METALLIZATION_PAD_simplified_abstract&oldid=248759>.

MHRA style

WikiPatents contributors, 'Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract', WikiPatents, , 18 October 2024, 00:42 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240347435)._SEMICONDUCTOR_PACKAGE_INCLUDING_UNDER_BUMP_METALLIZATION_PAD_simplified_abstract&oldid=248759> [accessed 22 October 2024]

Chicago style

WikiPatents contributors, "Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240347435)._SEMICONDUCTOR_PACKAGE_INCLUDING_UNDER_BUMP_METALLIZATION_PAD_simplified_abstract&oldid=248759 (accessed October 22, 2024).

CBE/CSE style

WikiPatents contributors. Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract [Internet]. WikiPatents, ; 2024 Oct 18, 00:42 UTC [cited 2024 Oct 22]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240347435)._SEMICONDUCTOR_PACKAGE_INCLUDING_UNDER_BUMP_METALLIZATION_PAD_simplified_abstract&oldid=248759.

Bluebook style

Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240347435)._SEMICONDUCTOR_PACKAGE_INCLUDING_UNDER_BUMP_METALLIZATION_PAD_simplified_abstract&oldid=248759 (last visited October 22, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240347435)._SEMICONDUCTOR_PACKAGE_INCLUDING_UNDER_BUMP_METALLIZATION_PAD_simplified_abstract&oldid=248759",
   note = "[Online; accessed 22-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240347435)._SEMICONDUCTOR_PACKAGE_INCLUDING_UNDER_BUMP_METALLIZATION_PAD_simplified_abstract&oldid=248759}",
   note = "[Online; accessed 22-October-2024]"
 }


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