Cite This Page
Bibliographic details for Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract
- Page name: Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 11 October 2024 16:04 UTC
- Date retrieved: 19 October 2024 09:26 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595
- Page Version ID: 247595
Citation styles for Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract
APA style
Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract. (2024, October 11). WikiPatents, . Retrieved 09:26, October 19, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595.
MLA style
"Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract." WikiPatents, . 11 Oct 2024, 16:04 UTC. 19 Oct 2024, 09:26 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595>.
MHRA style
WikiPatents contributors, 'Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract', WikiPatents, , 11 October 2024, 16:04 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595> [accessed 19 October 2024]
Chicago style
WikiPatents contributors, "Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595 (accessed October 19, 2024).
CBE/CSE style
WikiPatents contributors. Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract [Internet]. WikiPatents, ; 2024 Oct 11, 16:04 UTC [cited 2024 Oct 19]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595.
Bluebook style
Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595 (last visited October 19, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595",
note = "[Online; accessed 19-October-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339468)._SEMICONDUCTOR_PACKAGE_WITH_PROTECTIVE_MOLD_simplified_abstract&oldid=247595}",
note = "[Online; accessed 19-October-2024]"
}
