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Bibliographic details for Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Page name: Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 11 October 2024 16:02 UTC
- Date retrieved: 19 October 2024 09:19 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582
- Page Version ID: 247582
Citation styles for Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
APA style
Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract. (2024, October 11). WikiPatents, . Retrieved 09:19, October 19, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582.
MLA style
"Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract." WikiPatents, . 11 Oct 2024, 16:02 UTC. 19 Oct 2024, 09:19 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582>.
MHRA style
WikiPatents contributors, 'Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract', WikiPatents, , 11 October 2024, 16:02 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582> [accessed 19 October 2024]
Chicago style
WikiPatents contributors, "Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582 (accessed October 19, 2024).
CBE/CSE style
WikiPatents contributors. Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract [Internet]. WikiPatents, ; 2024 Oct 11, 16:02 UTC [cited 2024 Oct 19]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582.
Bluebook style
Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582 (last visited October 19, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582", note = "[Online; accessed 19-October-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240339336)._SUBSTRATE_HAVING_UNDERFILL_DAM_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME,_AND_METHOD_FOR_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=247582}", note = "[Online; accessed 19-October-2024]" }