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Bibliographic details for Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract

Citation styles for Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract

APA style

Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract. (2024, October 4). WikiPatents, . Retrieved 03:08, October 22, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240332112)._CHIP-SCALE_PACKAGE_ARCHITECTURES_CONTAINING_A_DIE_BACK_SIDE_METAL_AND_A_SOLDER_THERMAL_INTERFACE_MATERIAL_simplified_abstract&oldid=246253.

MLA style

"Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract." WikiPatents, . 4 Oct 2024, 15:37 UTC. 22 Oct 2024, 03:08 <http://wikipatents.org/index.php?title=Intel_corporation_(20240332112)._CHIP-SCALE_PACKAGE_ARCHITECTURES_CONTAINING_A_DIE_BACK_SIDE_METAL_AND_A_SOLDER_THERMAL_INTERFACE_MATERIAL_simplified_abstract&oldid=246253>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract', WikiPatents, , 4 October 2024, 15:37 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240332112)._CHIP-SCALE_PACKAGE_ARCHITECTURES_CONTAINING_A_DIE_BACK_SIDE_METAL_AND_A_SOLDER_THERMAL_INTERFACE_MATERIAL_simplified_abstract&oldid=246253> [accessed 22 October 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240332112)._CHIP-SCALE_PACKAGE_ARCHITECTURES_CONTAINING_A_DIE_BACK_SIDE_METAL_AND_A_SOLDER_THERMAL_INTERFACE_MATERIAL_simplified_abstract&oldid=246253 (accessed October 22, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract [Internet]. WikiPatents, ; 2024 Oct 4, 15:37 UTC [cited 2024 Oct 22]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240332112)._CHIP-SCALE_PACKAGE_ARCHITECTURES_CONTAINING_A_DIE_BACK_SIDE_METAL_AND_A_SOLDER_THERMAL_INTERFACE_MATERIAL_simplified_abstract&oldid=246253.

Bluebook style

Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240332112)._CHIP-SCALE_PACKAGE_ARCHITECTURES_CONTAINING_A_DIE_BACK_SIDE_METAL_AND_A_SOLDER_THERMAL_INTERFACE_MATERIAL_simplified_abstract&oldid=246253 (last visited October 22, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240332112)._CHIP-SCALE_PACKAGE_ARCHITECTURES_CONTAINING_A_DIE_BACK_SIDE_METAL_AND_A_SOLDER_THERMAL_INTERFACE_MATERIAL_simplified_abstract&oldid=246253",
   note = "[Online; accessed 22-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240332112)._CHIP-SCALE_PACKAGE_ARCHITECTURES_CONTAINING_A_DIE_BACK_SIDE_METAL_AND_A_SOLDER_THERMAL_INTERFACE_MATERIAL_simplified_abstract&oldid=246253}",
   note = "[Online; accessed 22-October-2024]"
 }


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