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Bibliographic details for Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract

Citation styles for Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract

APA style

Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract. (2024, September 27). WikiPatents, . Retrieved 02:24, October 19, 2024 from http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240321709)._PACKAGE_COMPRISING_AN_INTEGRATED_DEVICE_AND_A_METALLIZATION_PORTION_WITH_VARIABLE_THICKNESS_METALLIZATION_INTERCONNECTS_ON_A_SAME_METAL_LAYER_simplified_abstract&oldid=237941.

MLA style

"Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract." WikiPatents, . 27 Sep 2024, 06:29 UTC. 19 Oct 2024, 02:24 <http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240321709)._PACKAGE_COMPRISING_AN_INTEGRATED_DEVICE_AND_A_METALLIZATION_PORTION_WITH_VARIABLE_THICKNESS_METALLIZATION_INTERCONNECTS_ON_A_SAME_METAL_LAYER_simplified_abstract&oldid=237941>.

MHRA style

WikiPatents contributors, 'Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract', WikiPatents, , 27 September 2024, 06:29 UTC, <http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240321709)._PACKAGE_COMPRISING_AN_INTEGRATED_DEVICE_AND_A_METALLIZATION_PORTION_WITH_VARIABLE_THICKNESS_METALLIZATION_INTERCONNECTS_ON_A_SAME_METAL_LAYER_simplified_abstract&oldid=237941> [accessed 19 October 2024]

Chicago style

WikiPatents contributors, "Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240321709)._PACKAGE_COMPRISING_AN_INTEGRATED_DEVICE_AND_A_METALLIZATION_PORTION_WITH_VARIABLE_THICKNESS_METALLIZATION_INTERCONNECTS_ON_A_SAME_METAL_LAYER_simplified_abstract&oldid=237941 (accessed October 19, 2024).

CBE/CSE style

WikiPatents contributors. Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract [Internet]. WikiPatents, ; 2024 Sep 27, 06:29 UTC [cited 2024 Oct 19]. Available from: http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240321709)._PACKAGE_COMPRISING_AN_INTEGRATED_DEVICE_AND_A_METALLIZATION_PORTION_WITH_VARIABLE_THICKNESS_METALLIZATION_INTERCONNECTS_ON_A_SAME_METAL_LAYER_simplified_abstract&oldid=237941.

Bluebook style

Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract, http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240321709)._PACKAGE_COMPRISING_AN_INTEGRATED_DEVICE_AND_A_METALLIZATION_PORTION_WITH_VARIABLE_THICKNESS_METALLIZATION_INTERCONNECTS_ON_A_SAME_METAL_LAYER_simplified_abstract&oldid=237941 (last visited October 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240321709)._PACKAGE_COMPRISING_AN_INTEGRATED_DEVICE_AND_A_METALLIZATION_PORTION_WITH_VARIABLE_THICKNESS_METALLIZATION_INTERCONNECTS_ON_A_SAME_METAL_LAYER_simplified_abstract&oldid=237941",
   note = "[Online; accessed 19-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240321709)._PACKAGE_COMPRISING_AN_INTEGRATED_DEVICE_AND_A_METALLIZATION_PORTION_WITH_VARIABLE_THICKNESS_METALLIZATION_INTERCONNECTS_ON_A_SAME_METAL_LAYER_simplified_abstract&oldid=237941}",
   note = "[Online; accessed 19-October-2024]"
 }


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