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Bibliographic details for Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract

Citation styles for Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract

APA style

Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract. (2024, September 27). WikiPatents, . Retrieved 02:19, October 19, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240321902)._CHIP-ON-FILM_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=237154.

MLA style

"Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract." WikiPatents, . 27 Sep 2024, 05:23 UTC. 19 Oct 2024, 02:19 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240321902)._CHIP-ON-FILM_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=237154>.

MHRA style

WikiPatents contributors, 'Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract', WikiPatents, , 27 September 2024, 05:23 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240321902)._CHIP-ON-FILM_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=237154> [accessed 19 October 2024]

Chicago style

WikiPatents contributors, "Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240321902)._CHIP-ON-FILM_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=237154 (accessed October 19, 2024).

CBE/CSE style

WikiPatents contributors. Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract [Internet]. WikiPatents, ; 2024 Sep 27, 05:23 UTC [cited 2024 Oct 19]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240321902)._CHIP-ON-FILM_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=237154.

Bluebook style

Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240321902)._CHIP-ON-FILM_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=237154 (last visited October 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240321902)._CHIP-ON-FILM_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=237154",
   note = "[Online; accessed 19-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240321902). CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240321902)._CHIP-ON-FILM_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=237154}",
   note = "[Online; accessed 19-October-2024]"
 }


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