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Bibliographic details for Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract

Citation styles for Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract

APA style

Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract. (2024, September 26). WikiPatents, . Retrieved 13:19, October 19, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240318077)._ETCHING_COMPOSITION,_METAL-CONTAINING_FILM_ETCHING_METHOD_USING_THE_SAME_AND_SEMICONDUCTOR_DEVICE_MANUFACTURING_METHOD_USING_THE_SAME_simplified_abstract&oldid=237010.

MLA style

"Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract." WikiPatents, . 26 Sep 2024, 08:24 UTC. 19 Oct 2024, 13:19 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240318077)._ETCHING_COMPOSITION,_METAL-CONTAINING_FILM_ETCHING_METHOD_USING_THE_SAME_AND_SEMICONDUCTOR_DEVICE_MANUFACTURING_METHOD_USING_THE_SAME_simplified_abstract&oldid=237010>.

MHRA style

WikiPatents contributors, 'Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract', WikiPatents, , 26 September 2024, 08:24 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240318077)._ETCHING_COMPOSITION,_METAL-CONTAINING_FILM_ETCHING_METHOD_USING_THE_SAME_AND_SEMICONDUCTOR_DEVICE_MANUFACTURING_METHOD_USING_THE_SAME_simplified_abstract&oldid=237010> [accessed 19 October 2024]

Chicago style

WikiPatents contributors, "Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240318077)._ETCHING_COMPOSITION,_METAL-CONTAINING_FILM_ETCHING_METHOD_USING_THE_SAME_AND_SEMICONDUCTOR_DEVICE_MANUFACTURING_METHOD_USING_THE_SAME_simplified_abstract&oldid=237010 (accessed October 19, 2024).

CBE/CSE style

WikiPatents contributors. Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract [Internet]. WikiPatents, ; 2024 Sep 26, 08:24 UTC [cited 2024 Oct 19]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240318077)._ETCHING_COMPOSITION,_METAL-CONTAINING_FILM_ETCHING_METHOD_USING_THE_SAME_AND_SEMICONDUCTOR_DEVICE_MANUFACTURING_METHOD_USING_THE_SAME_simplified_abstract&oldid=237010.

Bluebook style

Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240318077)._ETCHING_COMPOSITION,_METAL-CONTAINING_FILM_ETCHING_METHOD_USING_THE_SAME_AND_SEMICONDUCTOR_DEVICE_MANUFACTURING_METHOD_USING_THE_SAME_simplified_abstract&oldid=237010 (last visited October 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240318077)._ETCHING_COMPOSITION,_METAL-CONTAINING_FILM_ETCHING_METHOD_USING_THE_SAME_AND_SEMICONDUCTOR_DEVICE_MANUFACTURING_METHOD_USING_THE_SAME_simplified_abstract&oldid=237010",
   note = "[Online; accessed 19-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240318077). ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240318077)._ETCHING_COMPOSITION,_METAL-CONTAINING_FILM_ETCHING_METHOD_USING_THE_SAME_AND_SEMICONDUCTOR_DEVICE_MANUFACTURING_METHOD_USING_THE_SAME_simplified_abstract&oldid=237010}",
   note = "[Online; accessed 19-October-2024]"
 }


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