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Bibliographic details for 18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation)

Citation styles for 18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation)

APA style

18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation). (2024, September 19). WikiPatents, . Retrieved 02:53, October 22, 2024 from http://wikipatents.org/index.php?title=18182879._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(Intel_Corporation)&oldid=235583.

MLA style

"18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation)." WikiPatents, . 19 Sep 2024, 10:52 UTC. 22 Oct 2024, 02:53 <http://wikipatents.org/index.php?title=18182879._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(Intel_Corporation)&oldid=235583>.

MHRA style

WikiPatents contributors, '18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation)', WikiPatents, , 19 September 2024, 10:52 UTC, <http://wikipatents.org/index.php?title=18182879._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(Intel_Corporation)&oldid=235583> [accessed 22 October 2024]

Chicago style

WikiPatents contributors, "18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18182879._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(Intel_Corporation)&oldid=235583 (accessed October 22, 2024).

CBE/CSE style

WikiPatents contributors. 18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Sep 19, 10:52 UTC [cited 2024 Oct 22]. Available from: http://wikipatents.org/index.php?title=18182879._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(Intel_Corporation)&oldid=235583.

Bluebook style

18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18182879._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(Intel_Corporation)&oldid=235583 (last visited October 22, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18182879._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(Intel_Corporation)&oldid=235583",
   note = "[Online; accessed 22-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18182879._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(Intel_Corporation)&oldid=235583}",
   note = "[Online; accessed 22-October-2024]"
 }


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