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Bibliographic details for Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract

Citation styles for Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract

APA style

Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract. (2024, September 19). WikiPatents, . Retrieved 02:50, October 22, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240312865)._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract&oldid=230395.

MLA style

"Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract." WikiPatents, . 19 Sep 2024, 05:57 UTC. 22 Oct 2024, 02:50 <http://wikipatents.org/index.php?title=Intel_corporation_(20240312865)._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract&oldid=230395>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract', WikiPatents, , 19 September 2024, 05:57 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240312865)._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract&oldid=230395> [accessed 22 October 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240312865)._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract&oldid=230395 (accessed October 22, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract [Internet]. WikiPatents, ; 2024 Sep 19, 05:57 UTC [cited 2024 Oct 22]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240312865)._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract&oldid=230395.

Bluebook style

Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240312865)._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract&oldid=230395 (last visited October 22, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240312865)._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract&oldid=230395",
   note = "[Online; accessed 22-October-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240312865)._METHODS,_SYSTEMS,_APPARATUS,_AND_ARTICLES_OF_MANUFACTURE_TO_IMPROVE_RELIABILITY_OF_VIAS_IN_A_GLASS_SUBSTRATE_OF_AN_INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract&oldid=230395}",
   note = "[Online; accessed 22-October-2024]"
 }


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