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Citation styles for 18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, September 9). WikiPatents, . Retrieved 17:47, September 19, 2024 from http://wikipatents.org/index.php?title=18664483._INTEGRATED_CIRCUIT_PACKAGE_AND_METHOD_OF_FORMING_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=225747.

MLA style

"18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 9 Sep 2024, 09:18 UTC. 19 Sep 2024, 17:47 <http://wikipatents.org/index.php?title=18664483._INTEGRATED_CIRCUIT_PACKAGE_AND_METHOD_OF_FORMING_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=225747>.

MHRA style

WikiPatents contributors, '18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 9 September 2024, 09:18 UTC, <http://wikipatents.org/index.php?title=18664483._INTEGRATED_CIRCUIT_PACKAGE_AND_METHOD_OF_FORMING_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=225747> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18664483._INTEGRATED_CIRCUIT_PACKAGE_AND_METHOD_OF_FORMING_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=225747 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Sep 9, 09:18 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18664483._INTEGRATED_CIRCUIT_PACKAGE_AND_METHOD_OF_FORMING_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=225747.

Bluebook style

18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18664483._INTEGRATED_CIRCUIT_PACKAGE_AND_METHOD_OF_FORMING_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=225747 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18664483._INTEGRATED_CIRCUIT_PACKAGE_AND_METHOD_OF_FORMING_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=225747",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18664483._INTEGRATED_CIRCUIT_PACKAGE_AND_METHOD_OF_FORMING_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=225747}",
   note = "[Online; accessed 19-September-2024]"
 }