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Bibliographic details for 18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, September 9). WikiPatents, . Retrieved 17:42, September 19, 2024 from http://wikipatents.org/index.php?title=18397354._SOLDER_REFLOW_APPARATUS_AND_METHOD_OF_MANUFACTURING_ELECTRONIC_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=225637.

MLA style

"18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 9 Sep 2024, 08:35 UTC. 19 Sep 2024, 17:42 <http://wikipatents.org/index.php?title=18397354._SOLDER_REFLOW_APPARATUS_AND_METHOD_OF_MANUFACTURING_ELECTRONIC_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=225637>.

MHRA style

WikiPatents contributors, '18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 9 September 2024, 08:35 UTC, <http://wikipatents.org/index.php?title=18397354._SOLDER_REFLOW_APPARATUS_AND_METHOD_OF_MANUFACTURING_ELECTRONIC_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=225637> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18397354._SOLDER_REFLOW_APPARATUS_AND_METHOD_OF_MANUFACTURING_ELECTRONIC_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=225637 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Sep 9, 08:35 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18397354._SOLDER_REFLOW_APPARATUS_AND_METHOD_OF_MANUFACTURING_ELECTRONIC_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=225637.

Bluebook style

18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18397354._SOLDER_REFLOW_APPARATUS_AND_METHOD_OF_MANUFACTURING_ELECTRONIC_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=225637 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18397354._SOLDER_REFLOW_APPARATUS_AND_METHOD_OF_MANUFACTURING_ELECTRONIC_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=225637",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18397354._SOLDER_REFLOW_APPARATUS_AND_METHOD_OF_MANUFACTURING_ELECTRONIC_DEVICE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=225637}",
   note = "[Online; accessed 19-September-2024]"
 }


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