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Bibliographic details for 18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation)
- Page name: 18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 23 August 2024 02:16 UTC
- Date retrieved: 19 September 2024 17:36 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442
- Page Version ID: 219442
Citation styles for 18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation)
APA style
18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation). (2024, August 23). WikiPatents, . Retrieved 17:36, September 19, 2024 from http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442.
MLA style
"18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation)." WikiPatents, . 23 Aug 2024, 02:16 UTC. 19 Sep 2024, 17:36 <http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442>.
MHRA style
WikiPatents contributors, '18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation)', WikiPatents, , 23 August 2024, 02:16 UTC, <http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442> [accessed 19 September 2024]
Chicago style
WikiPatents contributors, "18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442 (accessed September 19, 2024).
CBE/CSE style
WikiPatents contributors. 18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation) [Internet]. WikiPatents, ; 2024 Aug 23, 02:16 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442.
Bluebook style
18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation), http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442 (last visited September 19, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442",
note = "[Online; accessed 19-September-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18111939._SOLDER_VOLUME_FOR_FLIP-CHIP_BONDING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=219442}",
note = "[Online; accessed 19-September-2024]"
}
