Cite This Page

Jump to navigation Jump to search

Bibliographic details for 18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated)

Citation styles for 18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated)

APA style

18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated). (2024, August 22). WikiPatents, . Retrieved 17:46, September 19, 2024 from http://wikipatents.org/index.php?title=18171428._PACKAGE_DIES_INCLUDING_VERTICAL_INTERCONNECTS_FOR_SIGNAL_AND_POWER_DISTRIBUTION_IN_A_THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_PACKAGE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=218607.

MLA style

"18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated)." WikiPatents, . 22 Aug 2024, 14:47 UTC. 19 Sep 2024, 17:46 <http://wikipatents.org/index.php?title=18171428._PACKAGE_DIES_INCLUDING_VERTICAL_INTERCONNECTS_FOR_SIGNAL_AND_POWER_DISTRIBUTION_IN_A_THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_PACKAGE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=218607>.

MHRA style

WikiPatents contributors, '18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated)', WikiPatents, , 22 August 2024, 14:47 UTC, <http://wikipatents.org/index.php?title=18171428._PACKAGE_DIES_INCLUDING_VERTICAL_INTERCONNECTS_FOR_SIGNAL_AND_POWER_DISTRIBUTION_IN_A_THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_PACKAGE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=218607> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated)," WikiPatents, , http://wikipatents.org/index.php?title=18171428._PACKAGE_DIES_INCLUDING_VERTICAL_INTERCONNECTS_FOR_SIGNAL_AND_POWER_DISTRIBUTION_IN_A_THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_PACKAGE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=218607 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated) [Internet]. WikiPatents, ; 2024 Aug 22, 14:47 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18171428._PACKAGE_DIES_INCLUDING_VERTICAL_INTERCONNECTS_FOR_SIGNAL_AND_POWER_DISTRIBUTION_IN_A_THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_PACKAGE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=218607.

Bluebook style

18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated), http://wikipatents.org/index.php?title=18171428._PACKAGE_DIES_INCLUDING_VERTICAL_INTERCONNECTS_FOR_SIGNAL_AND_POWER_DISTRIBUTION_IN_A_THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_PACKAGE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=218607 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18171428._PACKAGE_DIES_INCLUDING_VERTICAL_INTERCONNECTS_FOR_SIGNAL_AND_POWER_DISTRIBUTION_IN_A_THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_PACKAGE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=218607",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18171428._PACKAGE_DIES_INCLUDING_VERTICAL_INTERCONNECTS_FOR_SIGNAL_AND_POWER_DISTRIBUTION_IN_A_THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_PACKAGE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=218607}",
   note = "[Online; accessed 19-September-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"