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Bibliographic details for 17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)

APA style

17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 02:21, June 23, 2024 from http://wikipatents.org/index.php?title=17879089._SEMICONDUCTOR_PACKAGE_AND_THERMAL_MANAGEMENT_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21703.

MLA style

"17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 18:49 UTC. 23 Jun 2024, 02:21 <http://wikipatents.org/index.php?title=17879089._SEMICONDUCTOR_PACKAGE_AND_THERMAL_MANAGEMENT_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21703>.

MHRA style

WikiPatents contributors, '17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 18:49 UTC, <http://wikipatents.org/index.php?title=17879089._SEMICONDUCTOR_PACKAGE_AND_THERMAL_MANAGEMENT_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21703> [accessed 23 June 2024]

Chicago style

WikiPatents contributors, "17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17879089._SEMICONDUCTOR_PACKAGE_AND_THERMAL_MANAGEMENT_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21703 (accessed June 23, 2024).

CBE/CSE style

WikiPatents contributors. 17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 18:49 UTC [cited 2024 Jun 23]. Available from: http://wikipatents.org/index.php?title=17879089._SEMICONDUCTOR_PACKAGE_AND_THERMAL_MANAGEMENT_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21703.

Bluebook style

17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17879089._SEMICONDUCTOR_PACKAGE_AND_THERMAL_MANAGEMENT_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21703 (last visited June 23, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17879089._SEMICONDUCTOR_PACKAGE_AND_THERMAL_MANAGEMENT_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21703",
   note = "[Online; accessed 23-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17879089._SEMICONDUCTOR_PACKAGE_AND_THERMAL_MANAGEMENT_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21703}",
   note = "[Online; accessed 23-June-2024]"
 }


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