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Bibliographic details for 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- Page name: 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 13 August 2024 06:33 UTC
- Date retrieved: 19 September 2024 17:42 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908
- Page Version ID: 214908
Citation styles for 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
APA style
18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, August 13). WikiPatents, . Retrieved 17:42, September 19, 2024 from http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908.
MLA style
"18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 13 Aug 2024, 06:33 UTC. 19 Sep 2024, 17:42 <http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908>.
MHRA style
WikiPatents contributors, '18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 13 August 2024, 06:33 UTC, <http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908> [accessed 19 September 2024]
Chicago style
WikiPatents contributors, "18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908 (accessed September 19, 2024).
CBE/CSE style
WikiPatents contributors. 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Aug 13, 06:33 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908.
Bluebook style
18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908 (last visited September 19, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908", note = "[Online; accessed 19-September-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18640167._HYBRID_BONDING_WITH_UNIFORM_PATTERN_DENSITY_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214908}", note = "[Online; accessed 19-September-2024]" }