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Bibliographic details for 18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

Citation styles for 18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, August 13). WikiPatents, . Retrieved 17:40, September 19, 2024 from http://wikipatents.org/index.php?title=18616427._Fan-Out_Package_Having_a_Main_Die_and_a_Dummy_Die_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214900.

MLA style

"18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 13 Aug 2024, 06:33 UTC. 19 Sep 2024, 17:40 <http://wikipatents.org/index.php?title=18616427._Fan-Out_Package_Having_a_Main_Die_and_a_Dummy_Die_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214900>.

MHRA style

WikiPatents contributors, '18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 13 August 2024, 06:33 UTC, <http://wikipatents.org/index.php?title=18616427._Fan-Out_Package_Having_a_Main_Die_and_a_Dummy_Die_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214900> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18616427._Fan-Out_Package_Having_a_Main_Die_and_a_Dummy_Die_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214900 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Aug 13, 06:33 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18616427._Fan-Out_Package_Having_a_Main_Die_and_a_Dummy_Die_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214900.

Bluebook style

18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18616427._Fan-Out_Package_Having_a_Main_Die_and_a_Dummy_Die_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214900 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18616427._Fan-Out_Package_Having_a_Main_Die_and_a_Dummy_Die_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214900",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18616427._Fan-Out_Package_Having_a_Main_Die_and_a_Dummy_Die_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=214900}",
   note = "[Online; accessed 19-September-2024]"
 }


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