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Bibliographic details for Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract

Citation styles for Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract

APA style

Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract. (2024, August 11). WikiPatents, . Retrieved 17:44, September 19, 2024 from http://wikipatents.org/index.php?title=Applied_materials,_inc._(20240266319)._Method_of_Multi-layer_Die_Stacking_with_Die-to-Wafer_Bonding_simplified_abstract&oldid=214030.

MLA style

"Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract." WikiPatents, . 11 Aug 2024, 06:55 UTC. 19 Sep 2024, 17:44 <http://wikipatents.org/index.php?title=Applied_materials,_inc._(20240266319)._Method_of_Multi-layer_Die_Stacking_with_Die-to-Wafer_Bonding_simplified_abstract&oldid=214030>.

MHRA style

WikiPatents contributors, 'Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract', WikiPatents, , 11 August 2024, 06:55 UTC, <http://wikipatents.org/index.php?title=Applied_materials,_inc._(20240266319)._Method_of_Multi-layer_Die_Stacking_with_Die-to-Wafer_Bonding_simplified_abstract&oldid=214030> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Applied_materials,_inc._(20240266319)._Method_of_Multi-layer_Die_Stacking_with_Die-to-Wafer_Bonding_simplified_abstract&oldid=214030 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract [Internet]. WikiPatents, ; 2024 Aug 11, 06:55 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=Applied_materials,_inc._(20240266319)._Method_of_Multi-layer_Die_Stacking_with_Die-to-Wafer_Bonding_simplified_abstract&oldid=214030.

Bluebook style

Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract, http://wikipatents.org/index.php?title=Applied_materials,_inc._(20240266319)._Method_of_Multi-layer_Die_Stacking_with_Die-to-Wafer_Bonding_simplified_abstract&oldid=214030 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Applied_materials,_inc._(20240266319)._Method_of_Multi-layer_Die_Stacking_with_Die-to-Wafer_Bonding_simplified_abstract&oldid=214030",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Applied_materials,_inc._(20240266319)._Method_of_Multi-layer_Die_Stacking_with_Die-to-Wafer_Bonding_simplified_abstract&oldid=214030}",
   note = "[Online; accessed 19-September-2024]"
 }


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