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Bibliographic details for 18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- Page name: 18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 January 2024 17:51 UTC
- Date retrieved: 26 June 2024 13:12 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294
- Page Version ID: 21294
Citation styles for 18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)
APA style
18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 13:12, June 26, 2024 from http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294.
MLA style
"18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 17:51 UTC. 26 Jun 2024, 13:12 <http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294>.
MHRA style
WikiPatents contributors, '18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 17:51 UTC, <http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. 18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 17:51 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294.
Bluebook style
18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294",
note = "[Online; accessed 26-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18063029._APPARATUS_AND_METHOD_OF_MANUFACTURING_SOLDER_BUMP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=21294}",
note = "[Online; accessed 26-June-2024]"
}
