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Bibliographic details for 18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.)

Citation styles for 18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.)

APA style

18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.). (2024, July 26). WikiPatents, . Retrieved 04:01, September 19, 2024 from http://wikipatents.org/index.php?title=18509188._BUFFER_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_AND_MEMORY_CHIP_simplified_abstract_(SK_hynix_Inc.)&oldid=204760.

MLA style

"18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.)." WikiPatents, . 26 Jul 2024, 03:36 UTC. 19 Sep 2024, 04:01 <http://wikipatents.org/index.php?title=18509188._BUFFER_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_AND_MEMORY_CHIP_simplified_abstract_(SK_hynix_Inc.)&oldid=204760>.

MHRA style

WikiPatents contributors, '18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.)', WikiPatents, , 26 July 2024, 03:36 UTC, <http://wikipatents.org/index.php?title=18509188._BUFFER_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_AND_MEMORY_CHIP_simplified_abstract_(SK_hynix_Inc.)&oldid=204760> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=18509188._BUFFER_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_AND_MEMORY_CHIP_simplified_abstract_(SK_hynix_Inc.)&oldid=204760 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.) [Internet]. WikiPatents, ; 2024 Jul 26, 03:36 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18509188._BUFFER_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_AND_MEMORY_CHIP_simplified_abstract_(SK_hynix_Inc.)&oldid=204760.

Bluebook style

18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.), http://wikipatents.org/index.php?title=18509188._BUFFER_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_AND_MEMORY_CHIP_simplified_abstract_(SK_hynix_Inc.)&oldid=204760 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18509188._BUFFER_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_AND_MEMORY_CHIP_simplified_abstract_(SK_hynix_Inc.)&oldid=204760",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18509188._BUFFER_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_BUFFER_CHIP_AND_MEMORY_CHIP_simplified_abstract_(SK_hynix_Inc.)&oldid=204760}",
   note = "[Online; accessed 19-September-2024]"
 }


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