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Citation styles for 18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.)

APA style

18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.). (2024, July 26). WikiPatents, . Retrieved 04:05, September 19, 2024 from http://wikipatents.org/index.php?title=18005745._Dielectric_Material_Layer,_Surface_Treatment_Method,_Package_Substrate,_and_Electronic_Device_simplified_abstract_(Honor_Device_Co.,_Ltd.)&oldid=204722.

MLA style

"18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.)." WikiPatents, . 26 Jul 2024, 03:33 UTC. 19 Sep 2024, 04:05 <http://wikipatents.org/index.php?title=18005745._Dielectric_Material_Layer,_Surface_Treatment_Method,_Package_Substrate,_and_Electronic_Device_simplified_abstract_(Honor_Device_Co.,_Ltd.)&oldid=204722>.

MHRA style

WikiPatents contributors, '18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.)', WikiPatents, , 26 July 2024, 03:33 UTC, <http://wikipatents.org/index.php?title=18005745._Dielectric_Material_Layer,_Surface_Treatment_Method,_Package_Substrate,_and_Electronic_Device_simplified_abstract_(Honor_Device_Co.,_Ltd.)&oldid=204722> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18005745._Dielectric_Material_Layer,_Surface_Treatment_Method,_Package_Substrate,_and_Electronic_Device_simplified_abstract_(Honor_Device_Co.,_Ltd.)&oldid=204722 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jul 26, 03:33 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18005745._Dielectric_Material_Layer,_Surface_Treatment_Method,_Package_Substrate,_and_Electronic_Device_simplified_abstract_(Honor_Device_Co.,_Ltd.)&oldid=204722.

Bluebook style

18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.), http://wikipatents.org/index.php?title=18005745._Dielectric_Material_Layer,_Surface_Treatment_Method,_Package_Substrate,_and_Electronic_Device_simplified_abstract_(Honor_Device_Co.,_Ltd.)&oldid=204722 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18005745._Dielectric_Material_Layer,_Surface_Treatment_Method,_Package_Substrate,_and_Electronic_Device_simplified_abstract_(Honor_Device_Co.,_Ltd.)&oldid=204722",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18005745._Dielectric_Material_Layer,_Surface_Treatment_Method,_Package_Substrate,_and_Electronic_Device_simplified_abstract_(Honor_Device_Co.,_Ltd.)&oldid=204722}",
   note = "[Online; accessed 19-September-2024]"
 }